Contract manufacturing for fabless teams
You designed the chip. Building it is our part.
Huijingtai takes a finished design into production in mainland China — wafer supply, assembly and packaging, test and qualification — and hands back parts you can put on a board. We hold the foundry and assembly relationships a small team cannot open on its own.
Why the door does not open
Nothing about a first product is unusual, and that is the problem. Three things stop a small team from getting an answer, and none of them are technical.
Your volume is below the threshold
A foundry lot and an assembly batch are priced around volumes most first products never reach. An order for twenty thousand parts is rarely refused. It simply goes unanswered.
The process assumes you already speak it
Tape-out packages, process control structures, probe cards, qualification plans. Suppliers expect the vocabulary before they will quote, and quoting a stranger costs them engineering hours.
Nobody is carrying your risk
Behind a first order sit yield, rework, scrap and a schedule no one has underwritten. Suppliers want a customer who has been through it before, which is exactly what you are not yet.
That gap is where we sit. We hold the accounts and the working relationships with foundries and assembly houses ourselves, so a first order rides on our standing with the line rather than on your own purchase history.
What we do
Four stages. You can hand us all of them, or join at whichever one you have reached.
Wafer supply and foundry access
We place your design with a foundry matched to the process node and the volume, including multi-project wafer shuttles when you need first silicon before you need a full lot. Where you already hold wafers, we take them from your account and carry on from there.
Assembly and packaging
Wafer probe, backgrinding, dicing, die attach, wire bond or flip chip, moulding, laser marking and singulation. This is the part of the chain we know best and the reason most customers first write to us.
Test
Wafer sort and final test on commercial ATE. Load boards, probe cards and test programs are developed against your limits — DC, RF and mixed-signal. Where a parameter is beyond a standard cell, we build a hybrid one and tell you what it costs before we start.
Qualification and supply
HTOL, temperature humidity bias, temperature cycling, moisture sensitivity and ESD, to commercial or automotive grade. Then tape-and-reel, lot traceability and repeat supply on a schedule.
Package families we place
Body sizes and pin counts below are the ranges we work within routinely. The exact envelope depends on the line assigned to your build, and we confirm it in writing before quoting.
| Family | Typical body size | Pin count | Interconnect |
|---|---|---|---|
| QFN, DFN | 2 × 2 to 12 × 12 mm | 3 – 100 | Wire bond |
| LQFP, TQFP | 7 × 7 to 20 × 20 mm | 32 – 216 | Wire bond |
| LFCSP | 3 × 3 to 9 × 9 mm | 16 – 64 | Wire bond |
| BGA, LGA | 6 × 6 to 27 × 27 mm | 64 – 900 | Wire bond, flip chip |
| SOT, SOIC, MSOP | Standard JEDEC | 3 – 24 | Wire bond |
| Chip-on-board | To your board | — | Wire bond, glob top |
We ask questions before we quote
Every enquiry is screened for end use and destination before we approach a supplier. Where a product sits on a controlled list, we ask for an end-user statement, and we will not go further without one.
This is not process for its own sake. A supplier who learns the answer late stops the line, and the loss lands on you, mid-programme, with tooling already paid for. We would rather lose an enquiry in week one than a programme in month six.
Tell us what you have
A design under NDA, a wafer lot sitting in a foundry account, or a part you are buying today and would rather build. Any of those is enough to start a conversation.